New Mod5 Series Flip-Top BGA Socket offers compact, surface mountable solution for 0.50mm pitch BGA device test and validation.
The new Mod5 Series design provides a compact, surface mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance. Features include:
- Accommodates BGA packages up to 12mm sq. (22 x 22 rows), with larger sizes available upon request
- Precision machined spring probes offer high bandwidth with very low insertion loss
- Compact size (20 x 27mm) enables use on design boards with small keepout zone
- Flip-Top BGA Socket’s easy actuation with simple cover and turn-screw heat sink enables quick insertion and extraction
- SMT design lowers test board costs by allowing use of alternative pad plating (vs. gold) and eliminating the need for expensive hardware and mounting holes which interfere with PCB traces
- Modular design enables simple reflow process, similar to BGA device
- Metallic probes offer proven reliability over elastomeric sockets and long-life (spring probe contact system life is 200,000 cycles minimum)
Additional mounting options and custom designs available.
Product information available online at http://www.advanced.com/adv_fliptopmod5.html
Data sheet available at: http://www.advanced.com/pdf/AIC_Flip-Top_Mod5_DataSheet_rev2.pdf
Advanced Interconnections Corp. | www.advanced.com | Tel: 401-823-5200 | info@advanced.com
Tags: 0.5mm pitch, Advanced Interconnections, bgasockets.com, CSP, fine pitch, Flip-Top, footprint, interconnect, low profile connector, machined-pin, RoHS Compliant, semiconductors, SMT, socket, solder ball, Terminals, test socket
