And then it happens. Device changes require additional rounds of validation. The package is transitioned from QFP to BGA and you have 2,000 boards
Customized Sockets and Adapters from Advanced Interconnections
left in stock. Board assembly comes to a halt because the device shipment is late. The product is shipped to the field and now you need to upgrade the device.
Fortunately there is a cost-effective solution. Device-to-board sockets and adapters are the key to cost-effective device validation, IC package conversion, and easy field replacement. Customized designs from Advanced go beyond the original application to add functionality, reduce space, integrate other components, and more. Call us to learn about the options. Download our Customized Interconnect Solutions brochure to see all of our capabilities.
With Advanced, it is easy.
Advanced Interconnections Corp. | West Warwick, RI USA | www.advanced.com | Tel: 401-823-5200 | info@advanced.com
Tags: adapter, Advanced Interconnections, advanced.com, ball grid array, BGA, board to board, custom connectors, fine pitch, footprint, IC socket, IC validation, interconnect, interconnection, lead-free, machined-pin, removable carrier, RoHS Compliant, solder ball, surface mount, test socket
